CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
Funds construction, expansion, or modernization of commercial facilities for semiconductor materials and semiconductor manufacturing equipment for eligible covered entities.
RESTRICTED TO: NONPROFITS
⚑ Applicant must be a 'covered entity' with demonstrated ability to substantially finance, construct, expand, or modernize a relevant facility. · Applications must be submitted through the CHIPS Incentives Portal. · Cooperative agreement mechanism. · Commercial facilities only; not a research grant.
Unit fits — one characterization, each unit's own rules
| Tom Love Innovation Hub | 30 weak | prototyping/demonstration stage; deep-tech content |
| IPPRA | 15 none | university cannot apply directly (ineligible) |
| Physical Sciences & Engineering (demo) | 15 none | university cannot apply directly (ineligible) |
Description
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.
For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov . If you have any questions on how to apply, please email apply@chips.gov.
Eligibility
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
Apply
View on Grants.gov → CONTACT: Misty L Roosa Management Analyst <apply@chips.gov>
Proposal brief SEE AN EXAMPLE →
A one-page internal memo: fit assessment, submission requirements, document scaffold, and next steps dated back from the deadline — tailored to your project idea if you add one.
Proposal shell · NOAA / Department of Commerce conventions SEE A NOAA EXAMPLE →
Funder-faithful document skeletons — NOAA / Department of Commerce's document set with section headings, page limits, reviewer guidance, and writing prompts; add a project idea to get [DRAFT] starter bullets. Download as .md for Word or Overleaf.