IPPRA / Grant Monitor

2026-09-06
3129Open opportunities
23IPPRA ≥ 60
0Not yet characterized
580Awaiting detail
2026-09-05Last fetch
Lens
Deadline
Score
Funds
Topic
Category
All
IPPRA fit Opportunity Topics Ceiling Posted Closes Days
15 Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies W52P1J26R0001 · DEPT OF THE ARMY · DEPT OF THE ARMY · other materials manufacturing national security defense cybersecurity 2026-08-17 2026-09-16 10
15 Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies W52P1J26R0001 · DEPT OF THE ARMY · DEPT OF THE ARMY · other national security defense materials manufacturing computing communications 2026-08-18 2026-09-16 10
15 Bureau of Engraving and Printing (BEP) Request for Information (RFI) - Device Assisted Security Features - FY26 2031ZA26N00007 · BUREAU OF ENGRAVING AND PRINTING · OFFICE OF THE CHIEF PROCUREMENT OFFICER · other materials manufacturing cybersecurity 2025-11-14 2026-11-15 70

3 OF 3 ROWS