|
15
|
Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
W52P1J26R0001 · DEPT OF THE ARMY · DEPT OF THE ARMY · other
|
materials manufacturing
national security defense
cybersecurity
|
— |
2026-08-17 |
2026-09-16 |
10 |
|
15
|
Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
W52P1J26R0001 · DEPT OF THE ARMY · DEPT OF THE ARMY · other
|
national security defense
materials manufacturing
computing communications
|
— |
2026-08-18 |
2026-09-16 |
10 |
|
15
|
Bureau of Engraving and Printing (BEP) Request for Information (RFI) - Device Assisted Security Features - FY26
2031ZA26N00007 · BUREAU OF ENGRAVING AND PRINTING · OFFICE OF THE CHIEF PROCUREMENT OFFICER · other
|
materials manufacturing
cybersecurity
|
— |
2025-11-14 |
2026-11-15 |
70 |