Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
Army special notice seeking industry and other respondents for secure packaged microelectronic components, printed circuit boards, and supporting technologies under a federal contract process.
⚑ Applicant restrictions: federal contract notice; not a standard grant or cooperative agreement. · Special notice / RFI-type submission referenced; see attachment for exact response requirements and deadlines. · Public universities are not direct applicants under the stated restriction. · Focus is on secure microelectronics/PCB technologies, likely with export/security and supply-chain sensitivity.
Unit fits — one characterization, each unit's own rules
| Tom Love Innovation Hub | 30 weak | prototyping/demonstration stage; deep-tech content |
| IPPRA | 15 none | university cannot apply directly (ineligible) |
| Physical Sciences & Engineering (demo) | 15 none | university cannot apply directly (ineligible) |
Description
Refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.
Eligibility
Applicant restrictions (federal contract). Set-aside: . Notice type: Special Notice. Organization: DEPT OF DEFENSE / DEPT OF THE ARMY / DEPT OF THE ARMY.
Apply
Proposal brief SEE AN EXAMPLE →
A one-page internal memo: fit assessment, submission requirements, document scaffold, and next steps dated back from the deadline — tailored to your project idea if you add one.
Proposal shell · Department of Defense (BAA-style) conventions SEE A DOD EXAMPLE →
Funder-faithful document skeletons — Department of Defense (BAA-style)'s document set with section headings, page limits, reviewer guidance, and writing prompts; add a project idea to get [DRAFT] starter bullets. Download as .md for Word or Overleaf.