Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
This Army special notice seeks responses on secure packaged microelectronic components, printed circuit boards, and related supporting technologies for defense purposes.
⚑ Federal contract notice; applicant restrictions apply, but the specific eligible applicant classes are not stated in the notice text provided. · Special Notice/RFI-style response requested; check attached document for exact submission requirements and whether this is for market research rather than a funded award.
Unit fits — one characterization, each unit's own rules
| Tom Love Innovation Hub | 45 partial | funds applied research; prototyping/demonstration stage; deep-tech content |
| IPPRA | 15 none | university cannot apply directly (ineligible) |
| Physical Sciences & Engineering (demo) | 15 none | university cannot apply directly (ineligible) |
Description
Refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.
Eligibility
Applicant restrictions (federal contract). Set-aside: . Notice type: Special Notice. Organization: DEPT OF DEFENSE / DEPT OF THE ARMY / DEPT OF THE ARMY.
Apply
Proposal brief SEE AN EXAMPLE →
A one-page internal memo: fit assessment, submission requirements, document scaffold, and next steps dated back from the deadline — tailored to your project idea if you add one.
Proposal shell · Department of Defense (BAA-style) conventions SEE A DOD EXAMPLE →
Funder-faithful document skeletons — Department of Defense (BAA-style)'s document set with section headings, page limits, reviewer guidance, and writing prompts; add a project idea to get [DRAFT] starter bullets. Download as .md for Word or Overleaf.